Single substrate touch sensor

ABSTRACT

The embodiments described herein are related to capacitive input device, including a substrate, a plurality of first sensor electrodes deposited on the substrate and arranged in a first direction, an insulating layer, a plurality of connecting elements deposited on the insulating layer, a plurality of second sensor electrodes. The plurality of second sensor electrodes includes a plurality of sensor electrode elements deposited on the substrate ohmically isolated from the plurality of first sensor electrodes. Each of the plurality of sensor electrode elements are connected to at least one other sensor electrode element arranged in a second direction by one of the plurality of connecting elements. The capacitive input device may further include a plurality of routing elements deposited on the insulating layer, wherein each of the plurality of routing elements coupled to one of the plurality of second sensor electrodes and is substantially disposed in the first direction.

CROSS-REFERENCE TO RELATED APPLICATIONS

This Application claims priority to U.S. Provisional Application No.61/555,415, filed Nov. 3, 3011.

TECHNICAL FIELD

This following generally relates to electronic devices.

BACKGROUND

Input devices including proximity sensor devices (also commonly calledtouchpads or touch sensor devices) are widely used in a variety ofelectronic systems. A proximity sensor device typically includes asensing region, often demarked by a surface, in which the proximitysensor device determines the presence, location and/or motion of one ormore input objects. Proximity sensor devices may be used to provideinterfaces for the electronic system. For example, proximity sensordevices are often used as input devices for larger computing systems(such as opaque touchpads integrated in, or peripheral to, notebook ordesktop computers). Proximity sensor devices are also often used insmaller computing systems (such as touch screens integrated in cellularphones).

SUMMARY

In one embodiment, for example, a capacitive input device is provided.The capacitive input device may include, but is not limited to, asubstrate, a plurality of first sensor electrodes deposited on thesubstrate and arranged in a first direction, an insulating layer, aplurality of connecting elements deposited on the insulating layer, aplurality of second sensor electrodes including a plurality of sensorelectrode elements deposited on the substrate ohmically isolated fromthe plurality of first sensor electrodes, wherein each of the pluralityof sensor electrode elements are connected to at least one other sensorelectrode element arranged in a second direction by one of the pluralityof connecting elements and a plurality of routing elements deposited onthe insulating layer, wherein each of the plurality of routing elementscoupled to one of the plurality of second sensor electrodes and issubstantially disposed in the first direction.

In accordance with another embodiment, for example, a method forconstructing a capacitive input device is provided. The method mayinclude, but is not limited to, providing a substrate, depositing afirst array of sensor electrodes on the substrate, the first array ofsensor electrodes arranged in rows in a first direction, depositing aplurality of sensor electrode elements on the substrate, the pluralityof sensor electrode elements ohmically isolated from the first array ofsensor electrodes, depositing an insulating layer over the first arrayof sensor electrodes and plurality of sensor electrode elements,depositing a plurality of connecting elements onto the insulating layer,wherein each of the plurality of connecting elements ohmically coupletwo of the plurality of sensor electrode elements arranged in a seconddirection to form a second array of sensor electrodes arranged in thesecond direction, and depositing a plurality of routing traces onto theinsulating layer, wherein each routing trace is ohmically coupled to oneof the sensor electrodes of the second array and each routing traceextends substantially along the first direction.

In accordance with another embodiment, a transcapacitive input device isprovided. The transcapacitive input device may include, but is notlimited to, a substrate, an insulating layer, a first array of sensorelectrodes deposited in rows on the substrate, each of the first arrayof first sensor electrodes having a first major axis aligned in a firstdirection, a plurality of connecting elements deposited on theinsulating layer, a second array of sensor electrodes having a secondmajor axis aligned in a second direction substantially perpendicular tothe first direction, wherein the second array of sensor electrodesincludes a plurality of sensor electrode elements deposited on thesubstrate ohmically isolated from the first array of sensor electrodes,wherein each of the plurality of sensor electrode elements are connectedto at least one other sensor electrode element arranged in the seconddirection by one of the plurality of connecting elements, and thetranscapacitive input device may further include a plurality of routingelements deposited on the insulating layer, wherein each of theplurality of routing elements coupled to one of the electrodes of thesecond array and is substantially disposed in the first direction.

BRIEF DESCRIPTION OF DRAWINGS

The preferred exemplary embodiment of the present invention willhereinafter be described in conjunction with the appended drawings,where like designations denote like elements, and:

FIG. 1 is a block diagram of an exemplary system that includes an inputdevice, in accordance with an embodiment;

FIG. 2 is a block diagram of an input device, in accordance with anembodiment;

FIG. 3 illustrates an exemplary sensor electrode layer, in accordancewith an embodiment;

FIG. 4 illustrates an exemplary layer of jumpers and traces, inaccordance with an embodiment;

FIG. 5 illustrates a combination of the sensor electrode layer and thelayer of jumpers and traces, in accordance with an embodiment;

FIG. 6 illustrates another exemplary sensor electrode layer, inaccordance with an embodiment;

FIG. 7 illustrates another exemplary layer of jumpers and traces, inaccordance with an embodiment;

FIG. 8 illustrates a combination of the sensor electrode layer and thelayer of jumpers and traces illustrated in FIGS. 6 and 7, in accordancewith an embodiment.

FIG. 9 is a flow chart illustrating an exemplary method for constructingan input device, in accordance with an embodiment.

DETAILED DESCRIPTION

The following detailed description is merely exemplary in nature and isnot intended to limit the invention or the application and uses of theinvention. Furthermore, there is no intention to be bound by anyexpressed or implied theory presented in the preceding technical field,background, brief summary or the following detailed description.

Various embodiments of the present invention provide input devices andmethods that facilitate improved usability.

Turning now to the figures, FIG. 1 is a block diagram of an exemplaryinput device 100, in accordance with embodiments of the invention. Theinput device 100 may be configured to provide input to an electronicsystem (not shown). As used in this document, the term “electronicsystem” (or “electronic device”) broadly refers to any system capable ofelectronically processing information. Some non-limiting examples ofelectronic systems include personal computers of all sizes and shapes,such as desktop computers, laptop computers, netbook computers, tablets,web browsers, e-book readers, and personal digital assistants (PDAs).Additional example electronic systems include composite input devices,such as physical keyboards that include input device 100 and separatejoysticks or key switches. Further example electronic systems includeperipherals such as data input devices (including remote controls andmice), and data output devices (including display screens and printers).Other examples include remote terminals, kiosks, and video game machines(e.g., video game consoles, portable gaming devices, and the like).Other examples include communication devices (including cellular phones,such as smart phones), and media devices (including recorders, editors,and players such as televisions, set-top boxes, music players, digitalphoto frames, and digital cameras). Additionally, the electronic systemcould be a host or a slave to the input device.

The input device 100 can be implemented as a physical part of theelectronic system, or can be physically separate from the electronicsystem. As appropriate, the input device 100 may communicate with partsof the electronic system using any one or more of the following: buses,networks, and other wired or wireless interconnections. Examples includeI²C, SPI, PS/2, Universal Serial Bus (USB), Bluetooth, RF, and IRDA.

In FIG. 1, the input device 100 is shown as a proximity sensor device(also often referred to as a “touchpad” or a “touch sensor device”)configured to sense input provided by one or more input objects 140 in asensing region 120. Example input objects include fingers and styli, asshown in FIG. 1.

Sensing region 120 encompasses any space above, around, in and/or nearthe input device 100 in which the input device 100 is able to detectuser input (e.g., user input provided by one or more input objects 140).The sizes, shapes, and locations of particular sensing regions may varywidely from embodiment to embodiment. In some embodiments, the sensingregion 120 extends from a surface of the input device 100 in one or moredirections into space until signal-to-noise ratios prevent sufficientlyaccurate object detection. The distance to which this sensing region 120extends in a particular direction, in various embodiments, may be on theorder of less than a millimeter, millimeters, centimeters, or more, andmay vary significantly with the type of sensing technology used and theaccuracy desired. Thus, some embodiments sense input that comprises nocontact with any surfaces of the input device 100, contact with an inputsurface (e.g. a touch surface) of the input device 100, contact with aninput surface of the input device 100 coupled with some amount ofapplied force or pressure, and/or a combination thereof. In variousembodiments, input surfaces may be provided by surfaces of casingswithin which the sensor electrodes reside, by face sheets applied overthe sensor electrodes or any casings, etc. In some embodiments, thesensing region 120 has a rectangular shape when projected onto an inputsurface of the input device 100.

The input device 100 may utilize any combination of sensor componentsand sensing technologies to detect user input in the sensing region 120.The input device 100 comprises one or more sensing elements fordetecting user input. As several non-limiting examples, the input device100 may use capacitive, elastive, resistive, inductive, magnetic,acoustic, ultrasonic, and/or optical techniques.

Some implementations are configured to provide images that span one,two, three, or higher dimensional spaces. Some implementations areconfigured to provide projections of input along particular axes orplanes.

In some resistive implementations of the input device 100, a flexibleand conductive first layer is separated by one or more spacer elementsfrom a conductive second layer. During operation, one or more voltagegradients are created across the layers. Pressing the flexible firstlayer may deflect it sufficiently to create electrical contact betweenthe layers, resulting in voltage outputs reflective of the point(s) ofcontact between the layers. These voltage outputs may be used todetermine positional information.

In some inductive implementations of the input device 100, one or moresensing elements pick up loop currents induced by a resonating coil orpair of coils. Some combination of the magnitude, phase, and frequencyof the currents may then be used to determine positional information.

In some capacitive implementations of the input device 100, voltage orcurrent is applied to create an electric field. Nearby input objectscause changes in the electric field, and produce detectable changes incapacitive coupling that may be detected as changes in voltage, current,or the like.

Some capacitive implementations utilize arrays or other regular orirregular patterns of capacitive sensing elements to create electricfields. In some capacitive implementations, separate sensing elementsmay be ohmically shorted together to form larger sensor electrodes. Somecapacitive implementations utilize resistive sheets, which may beuniformly resistive.

Some capacitive implementations utilize “self capacitance” (or “absolutecapacitance”) sensing methods based on changes in the capacitivecoupling between sensor electrodes and an input object. In variousembodiments, an input object near the sensor electrodes alters theelectric field near the sensor electrodes, thus changing the measuredcapacitive coupling. In one implementation, an absolute capacitancesensing method operates by modulating sensor electrodes with respect toa reference voltage (e.g. system ground), and by detecting thecapacitive coupling between the sensor electrodes and input objects.

Some capacitive implementations utilize “mutual capacitance” (or“transcapacitance”) sensing methods based on changes in the capacitivecoupling between sensor electrodes. In various embodiments, an inputobject near the sensor electrodes alters the electric field between thesensor electrodes, thus changing the measured capacitive coupling. Inone implementation, a transcapacitive sensing method operates bydetecting the capacitive coupling between one or more transmitter sensorelectrodes (also “transmitter electrodes” or “transmitters”) and one ormore receiver sensor electrodes (also “receiver electrodes” or“receivers”). Transmitter sensor electrodes may be modulated relative toa reference voltage (e.g., system ground) to transmit transmittersignals. Receiver sensor electrodes may be held substantially constantrelative to the reference voltage to facilitate receipt of resultingsignals. A resulting signal may comprise effect(s) corresponding to oneor more transmitter signals, and/or to one or more sources ofenvironmental interference (e.g. other electromagnetic signals). Sensorelectrodes may be dedicated transmitters or receivers, or may beconfigured to both transmit and receive.

In FIG. 1, a processing system 110 is shown as part of the input device100. The processing system 110 is configured to operate the hardware ofthe input device 100 to detect input in the sensing region 120. Theprocessing system 110 comprises parts of or all of one or moreintegrated circuits (ICs) and/or other circuitry components. Forexample, a processing system for a mutual capacitance sensor device maycomprise transmitter circuitry configured to transmit signals withtransmitter sensor electrodes, and/or receiver circuitry configured toreceive signals with receiver sensor electrodes). In some embodiments,the processing system 110 also comprises electronically-readableinstructions, such as firmware code, software code, and/or the like. Insome embodiments, components composing the processing system 110 arelocated together, such as near sensing element(s) of the input device100. In other embodiments, components of processing system 110 arephysically separate with one or more components close to sensingelement(s) of input device 100, and one or more components elsewhere.For example, the input device 100 may be a peripheral coupled to adesktop computer, and the processing system 110 may comprise softwareconfigured to run on a central processing unit of the desktop computerand one or more ICs (perhaps with associated firmware) separate from thecentral processing unit. As another example, the input device 100 may bephysically integrated in a phone, and the processing system 110 maycomprise circuits and firmware that are part of a main processor of thephone. In some embodiments, the processing system 110 is dedicated toimplementing the input device 100. In other embodiments, the processingsystem 110 also performs other functions, such as operating displayscreens, driving haptic actuators, etc.

The processing system 110 may be implemented as a set of modules thathandle different functions of the processing system 110. Each module maycomprise circuitry that is a part of the processing system 110,firmware, software, or a combination thereof In various embodiments,different combinations of modules may be used. Example modules includehardware operation modules for operating hardware such as sensorelectrodes and display screens, data processing modules for processingdata such as sensor signals and positional information, and reportingmodules for reporting information. Further example modules includesensor operation modules configured to operate sensing element(s) todetect input, identification modules configured to identify gesturessuch as mode changing gestures, and mode changing modules for changingoperation modes.

In some embodiments, the processing system 110 responds to user input(or lack of user input) in the sensing region 120 directly by causingone or more actions. Example actions include changing operation modes,as well as GUI actions such as cursor movement, selection, menunavigation, and other functions. In some embodiments, the processingsystem 110 provides information about the input (or lack of input) tosome part of the electronic system (e.g. to a central processing systemof the electronic system that is separate from the processing system110, if such a separate central processing system exists). In someembodiments, some part of the electronic system processes informationreceived from the processing system 110 to act on user input, such as tofacilitate a full range of actions, including mode changing actions andGUI actions.

For example, in some embodiments, the processing system 110 operates thesensing element(s) of the input device 100 to produce electrical signalsindicative of input (or lack of input) in the sensing region 120. Theprocessing system 110 may perform any appropriate amount of processingon the electrical signals in producing the information provided to theelectronic system. For example, the processing system 110 may digitizeanalog electrical signals obtained from the sensor electrodes. Asanother example, the processing system 110 may perform filtering orother signal conditioning. As yet another example, the processing system110 may subtract or otherwise account for a baseline, such that theinformation reflects a difference between the electrical signals and thebaseline. As yet further examples, the processing system 110 maydetermine positional information, recognize inputs as commands,recognize handwriting, and the like.

“Positional information” as used herein broadly encompasses absoluteposition, relative position, velocity, acceleration, and other types ofspatial information. Exemplary “zero-dimensional” positional informationincludes near/far or contact/no contact information. Exemplary“one-dimensional” positional information includes positions along anaxis. Exemplary “two-dimensional” positional information includesmotions in a plane. Exemplary “three-dimensional” positional informationincludes instantaneous or average velocities in space. Further examplesinclude other representations of spatial information. Historical dataregarding one or more types of positional information may also bedetermined and/or stored, including, for example, historical data thattracks position, motion, or instantaneous velocity over time.

In some embodiments, the input device 100 is implemented with additionalinput components that are operated by the processing system 110 or bysome other processing system. These additional input components mayprovide redundant functionality for input in the sensing region 120, orsome other functionality. FIG. 1 shows buttons 130 near the sensingregion 120 that can be used to facilitate selection of items using theinput device 100. Other types of additional input components includesliders, balls, wheels, switches, and the like. Conversely, in someembodiments, the input device 100 may be implemented with no other inputcomponents.

In some embodiments, the input device 100 comprises a touch screeninterface, and the sensing region 120 overlaps at least part of anactive area of a display screen. For example, the input device 100 maycomprise substantially transparent sensor electrodes overlaying thedisplay screen and provide a touch screen interface for the associatedelectronic system. The display screen may be any type of dynamic displaycapable of displaying a visual interface to a user, and may include anytype of light emitting diode (LED), organic LED (OLED), cathode ray tube(CRT), liquid crystal display (LCD), plasma, electroluminescence (EL),or other display technology. The input device 100 and the display screenmay share physical elements. For example, some embodiments may utilizesome of the same electrical components for displaying and sensing. Asanother example, the display screen may be operated in part or in totalby the processing system 110.

It should be understood that while many embodiments of the invention aredescribed in the context of a fully functioning apparatus, themechanisms of the present invention are capable of being distributed asa program product (e.g., software) in a variety of forms. For example,the mechanisms of the present invention may be implemented anddistributed as a software program on information bearing media that arereadable by electronic processors (e.g., non-transitorycomputer-readable and/or recordable/writable information bearing mediareadable by the processing system 110). Additionally, the embodiments ofthe present invention apply equally regardless of the particular type ofmedium used to carry out the distribution. Examples of non-transitory,electronically readable media include various discs, memory sticks,memory cards, memory modules, and the like. Electronically readablemedia may be based on flash, optical, magnetic, holographic, or anyother storage technology.

FIG. 2 is a block diagram of an input device 200, in accordance with anembodiment. The input device includes a base substrate 210. The basesubstrate 210 may be configured to be touched by input objects when partof an electronic device. Base substrate 210 may be any suitablesubstrate for contact with an input object, such as glass, Mylar, PET(Polyethylene terephthalate), plastic, printed circuit boards, flexibleprinted circuit substrates and the like. The base substrate 210 couldalso be patterned, etched or otherwise marked for improved tactile feeland/or visual appeal. In one embodiment, for example, the input device200 may include an optional ink layer 220 which may be used to provideartwork or some other visible markings that can be seen by the user ifthe base substrate 210 is substantially transparent (e.g. glass, PET,etc)

The input device 200 further includes a sensor electrode layer 230. Thesensor electrode layer includes an array of sensor electrodes arrangedin a first direction and an array of sensor electrode elements ohmicallyisolated from the array of sensor electrodes, as discussed in furtherdetail below. The array sensor electrodes and array of sensor electrodeelements can be coupled to sensor circuitry and sense input objects in asensing region. The sensor electrodes and sensor electrode elements maybe formed of any suitable conductive material, such as ITO (Indium tinoxide), copper, silver ink, carbon ink, and the like. In one embodiment,for example, the array of sensor electrodes may be coupled to a flexibleprinted circuit board (PCB) 260 which ohmically couples the array sensorelectrodes to a processing system of the input device 200.

The device further includes an insulating layer 240. The insulatinglayer 240 partially isolates the sensor electrodes from a layerconnecting elements 250. The layer of connecting elements ohmicallyconnect some of the sensor electrode elements in the sensor electrodelayer to a second array of sensor electrodes, as discussed in furtherdetail below. Furthermore, the layer of connecting elements 250ohmically couples the second array of sensor electrode elements to aprocessing system of the input device 200. In one embodiment, a flexiblePCB 260 ohmically couples the second array of sensor electrodes to theprocessing system of the input device 200. The input device 200 may alsoinclude a protective layer 270 to insulate and protect the connectinglayer 250. In one embodiment, for example, the input device 200 may alsoinclude a tact switch(s) or force sensor(s) 280 configured to provide anindication of force from an input objects deflecting the input device.In such an embodiment, the input device 200 may be part of a click-padtype input device or a force-enhanced type input device. The click padtype device or force enhanced type input device, for example, may rotateabout a single or multiple axes or otherwise deflect relative to ahousing of the electronic system.

FIG. 3 illustrates an exemplary sensor electrode layer 230, inaccordance with an embodiment. The sensor electrode layer 230 includesan array of sensor electrodes 300 arranged in a first direction (thefirst direction is illustrated horizontally in FIG. 3). Each of thesensor electrodes 300 may be coupled to a processing system along asingle side of the input device 200. The sensor electrode layer 230 alsoincludes an array of sensor electrode elements 310. Each of the sensorelectrode elements are ohmically isolated from the sensor electrodes 300and are ohmically isolated from each other in the sensor electrode layer230. As seen in FIG. 3, a portion of each sensor electrode element 310is deposited between each of the sensor electrodes 300. As discussed infurther detail below, the sensor electrode element 310 are ohmicallycoupled via connecting elements into a series of sensor electrodesarranged in a second direction (illustrated vertically in FIG. 3), whichmay be orthogonal to the first direction. Further, tracers are arrangedover the portion of the sensor electrode element 310 that are depositedbetween each of the sensor electrodes 300 such that the traces do notcross over any portion of any of the sensor electrodes 300, as discussedin further detail below.

FIG. 4 illustrates an exemplary layer of connecting elements 250, inaccordance with an embodiment, where the layer includes a plurality of“jumpers” 400. Each of the jumpers ohmically couple two of the sensorelectrode elements 310 arranged in the second direction (illustratedvertically in FIG. 4) with respect to each other. In one embodiment,each jumper is arranged over openings 420 in the insulating layer 240.Each opening 420 is configured to ohmically connect the jumper 400 to asensor electrode elements 310 in the sensor electrode layer 300 throughthe insulation layer 240. The openings 420 may comprises conductivematerial or vias which are configured to ohmically coupled the jumper400 to a sensor electrode 310. Accordingly, by connecting a series ofsensor electrode elements 310 with jumpers 400 in the second direction,an array of sensor electrodes is formed substantially arranged in thesecond direction. The layer of connecting elements 250 further includesa series of routing traces 410. Each routing trace 410 is coupled to oneof the sensor electrode elements 310 through an opening 420 and issubstantially arranged in the first direction. Each trace 410 couplesone of the sensor electrodes arranged in the second direction to theprocessing system 110 of the input device 200. Accordingly, since thetraces 410 are substantially arranged in the first direction and thearray of sensor electrodes 300 are substantially arranged in the firstdirection, all of the routing traces for the input device 200 can bearranged on a single edge of the device (e.g., the right edge asillustrated in FIGS. 3-5), allowing the overall size of the input deviceto be reduced.

FIG. 5 illustrates a combination of the sensor electrode layer 230 andthe layer of connectors 250, in accordance with an embodiment. It shouldbe noted that the insulation layer 240 is arranged between the sensorelectrode layer 230 and layer of connectors 250, however the insulationlayer 240 is not illustrated in FIG. 5 so that the arrangement of thejumpers 400 and routing traces 410 over the sensor electrode layer 230can be seen. As seen in FIG. 5, the jumpers 400 connect a series ofsensor electrode elements 310 arranged in the second direction to formthe second array sensor electrodes, hereinafter referred to as sensorelectrodes 500. Each of the sensor electrodes 500 are connected to oneof the routing traces 410. As seen in FIG. 5, the routing traces 410 arerouted in the same direction as the sensor electrodes 300. In oneembodiment, the routing traces 410 are arranged over a portion of thesensor electrode elements 310 arranged between each sensor electrode 300such that the traces 410 do not overlap any portion of the sensorelectrode 300. In one embodiment, for example, the sensor electrodes 500may be transmitter sensor electrodes and the sensor electrodes 300 maybe receiver sensor electrodes. In another embodiment, the routing traces410 may each extend substantially the same length along the firstdirection. Thus the routing trace 410 for each electrode of the secondarray of sensor electrodes is substantially the same length.

FIGS. 6-8 illustrate another exemplary input device 200, in accordancewith an embodiment. FIG. 6 illustrates an exemplary sensor electrodelayer 230, in accordance with an embodiment. The sensor electrode layer230 includes an array of sensor electrodes 600 arranged in a firstdirection (the first direction is illustrated horizontally in FIG. 3).Each of the sensor electrodes 600 may be coupled to a processing systemalong a single side of the input device 200. The sensor electrode layer230 also includes an array of sensor electrode elements 610. Each of thesensor electrode elements are ohmically isolated from the sensorelectrodes 600 and are ohmically isolated from each other in the sensorelectrode layer 230. As seen in FIG. 6, the sensor electrode elements610 are deposited between each of the sensor electrodes 600.

FIG. 7 illustrates an exemplary layer of connectors 250, in accordancewith an embodiment. The layer of connectors 250 includes a series ofjumpers 700. Each jumper 700 connects two of the sensor electrodeelements 610 arranged in the second direction (illustrated vertically inFIG. 7) with respect to each other. Each jumper 700 is arranged over twoopenings 720 in the insulating layer 240. Each opening 720 is configuredto ohmically connect the jumper 700 to a sensor electrode element 610 inthe sensor electrode layer 230 through the insulation layer 240.Accordingly, by connected a series of sensor electrode elements 610 withjumpers 700 in the second direction, an array of sensor electrodes isformed substantially arranged in the second direction. The layer ofconnectors 250 further includes a series of routing traces 710. Eachrouting trace 710 is coupled to one of the sensor electrode elements 610through an opening 720 and is substantially arranged in the firstdirection. Each routing trace 710 couples one of the sensor electrodesarranged in the second direction to the processing system 110 of theinput device 200. Accordingly, since the routing traces 710 aresubstantially arranged in the first direction and the array of sensorelectrodes 600 are substantially arranged in the first direction, all ofthe routing traces for the input device 200 can be arranged on a singleedge of the device (e.g., the right edge as illustrated in FIGS. 6-8),allowing the overall size of the input device to be reduced.

FIG. 8 illustrates a combination of the sensor electrode layer 230 andthe layer of connectors 250, in accordance with an embodiment. It shouldbe noted that the insulation layer 240 including the openings 720 wouldbe between the sensor electrode layer 230 and the layer of connectors250, however the insulation layer 240 is not illustrated in FIG. 8 sothat the arrangement of the jumpers 700 and routing traces 710 over thesensor electrode layer 230 can be seen. As seen in FIG. 8, the jumpers700 connect a series of sensor electrode elements 610 arranged in thesecond direction to form sensor electrodes, hereinafter referred to assensor electrodes 800. Each of the sensor electrodes 800 are connectedto one of the routing traces 710. As seen in FIG. 8, the routing traces710 are routed in the same direction as the sensor electrodes 600. Inone embodiment, the routing traces 710 are arranged over a portion ofthe sensor electrode elements 610 arranged between each sensor electrode600 such that the traces 710 do not overlap any portion of the sensorelectrode elements.

While FIGS. 3-8 illustrate two exemplary input devices 200, one ofordinary skill in the art would recognize the shape and patterning ofthe first array of sensor electrodes and the second array of sensorelectrode elements shown in the figures may vary. Furthermore, in otherembodiments, the first array may comprise isolated elements, extend inanother (non-horizontal) direction, and have a different shape thanshown. Likewise, the second array may comprise non-isolated elements andhave a different shape than shown.

FIG. 9 is a flow chart illustrating an exemplary method 900 forconstructing an input device, in accordance with an embodiment. Asdiscussed above, in one embodiment, an optional ink layer may first bedeposited on a base substrate. (Step 910). Various types of inks andprocesses may be used to form visual artifacts on the base substrate.This is particularly advantageous if the base substrate is substantiallytransparent, allowing a user to see the printed pattern. A sensorelectrode layer is then deposited on the base substrate. (Step 920). Thesensor electrode layer includes a first array of sensor electrodesarranged in a first direction and an array of sensor electrode elementsohmically isolated from each other and are arranged to form the secondarray of sensor electrodes, as discussed above. An insulating layer maythen be deposited onto the sensor electrode layer. (Step 930). Theinsulating layer may be patterned with holes or openings allowing ohmicconnection to the sensor electrode layer through the insulating layer. Aconnection layer is then disposed onto the insulating layer. (Step 940).The connection layer may include jumpers, routing traces and bondingpads which facilitate connection to a processing system (e.g. via aflexible circuit board assembly). A protective layer is then disposedonto the connection layer. (Step 950). The protective layer may comprisea wet coated silicate or acrylic material. The protective layer isconfigured to provide insulation and protection to the other layers ofthe input device from humidity, abrasion and the like. In someembodiments, a tact switch, a force sensor or other similar mechanism isattached to the input device assembly. (Step 960). In some embodiments,a processing system may also be communicatively coupled to the sensorelectrodes. A flexible circuit substrate may also be affixed to the edgeof the input device assembly, providing communication between the sensorelectrodes and the processing system. In one embodiment, the connectionsbetween the sensor electrodes and the processing system are made alongonly one edge of the sensor assembly.

The embodiments and examples set forth herein were presented in order tobest explain the present invention and its particular application and tothereby enable those skilled in the art to make and use the invention.However, those skilled in the art will recognize that the foregoingdescription and examples have been presented for the purposes ofillustration and example only. The description as set forth is notintended to be exhaustive or to limit the invention to the precise formdisclosed.

What is claimed is:
 1. A capacitive input device, comprising: asubstrate; a plurality of first sensor electrodes deposited on thesubstrate and arranged in a first direction; an insulating layer; aplurality of connecting elements deposited on the insulating layer; aplurality of second sensor electrodes comprising: a plurality of sensorelectrode elements deposited on the substrate ohmically isolated fromthe plurality of first sensor electrodes, wherein each of the pluralityof sensor electrode elements are connected to at least one other sensorelectrode element arranged in a second direction by one of the pluralityof connecting elements; a plurality of routing elements deposited on theinsulating layer, wherein each of the plurality of routing elementscoupled to one of the plurality of second sensor electrodes and issubstantially disposed in the first direction.
 2. The capacitive inputdevice of claim 1, wherein a portion of at least one sensor electrodeelement is disposed between each adjacent first sensor electrode.
 3. Thecapacitive input device of claim 2, wherein the plurality of routingelements are arranged on the insulating layer over the portion of thesensor electrode elements disposed between each adjacent first sensorelectrode.
 4. The capacitive input device of claim 1, further comprisinga processing system communicatively coupled to the first and secondplurality of sensor electrodes, wherein the processing system isconnected to the first and second plurality of sensor electrodes alongonly one edge of the substrate.
 5. The capacitive input device of claim1, wherein the first plurality of sensor electrodes are receiver sensorelectrodes and the second plurality of sensor electrodes are transmittersensor electrodes.
 6. The capacitive input device of claim 1, furthercomprising at least one sensor coupled to the substrate, the at leastone sensor configured to provide an indication of a pressure applied tothe substrate.
 7. The capacitive input device of claim 1, wherein thesubstrate is transparent.
 8. The capacitive input device of claim 7,further comprising indicia deposited on a first side of the substratevisible from a second side of the substrate.
 9. A method forconstructing a capacitive input device, the method comprising: providinga substrate; depositing a first array of sensor electrodes on thesubstrate, the first array of sensor electrodes arranged in a firstdirection; depositing a plurality of sensor electrode elements on thesubstrate, the plurality of sensor electrode elements ohmically isolatedfrom the first array of sensor electrodes; depositing an insulatinglayer over the first array of sensor electrodes and plurality of sensorelectrode elements; depositing a plurality of connecting elements ontothe insulating layer, wherein each of the plurality of connectingelements ohmically couple two of the plurality of sensor electrodeelements arranged in a second direction to form a second array of sensorelectrodes arranged in the second direction; and depositing a pluralityof routing traces onto the insulating layer, wherein each routing traceis ohmically coupled to one of the sensor electrodes of the second arrayand each routing trace extends substantially along the first direction.10. The method of claim 9, wherein a portion of at least one sensorelectrode element is disposed between each sensor electrode of the firstarray of sensor electrodes.
 11. The method of claim 9, wherein theplurality of routing elements are deposited on the insulating layer overthe portion of the sensor electrode elements disposed between each rowof the first array of sensor electrodes.
 12. A transcapacitive inputdevice, comprising: a substrate; an insulating layer; a first array ofsensor electrodes deposited in rows on the substrate, each of the firstarray of first sensor electrodes having a first major axis aligned in afirst direction; a plurality of connecting elements deposited on theinsulating layer; a second array of sensor electrodes having a secondmajor axis aligned in a second direction substantially perpendicular tothe first direction, the second array of sensor electrodes comprising: aplurality of sensor electrode elements deposited on the substrateohmically isolated from the first array of sensor electrodes, whereineach of the plurality of sensor electrode elements are connected to atleast one other sensor electrode element arranged in the seconddirection by one of the plurality of connecting elements; a plurality ofrouting elements deposited on the insulating layer, wherein each of theplurality of routing elements coupled to one of the electrodes of thesecond array and is substantially disposed in the first direction. 13.The transcapacitive input device of claim 12, wherein a portion of atleast one sensor electrode element is disposed between adjacent rows ofthe sensor electrodes of the first array.
 14. The transcapacitive inputdevice of claim 13, wherein the plurality of routing elements arearranged on the insulating layer over the portion of the sensorelectrode elements disposed between adjacent rows of the sensorelectrodes of the first array.
 15. The transcapacitive input device ofclaim 12, further comprising a processing system communicatively coupledto the first and second arrays of sensor electrodes, wherein theprocessing system is connected to the first and second arrays of sensorelectrodes along only one edge of the substrate.
 16. The transcapacitiveinput device of claim 15, wherein the substrate is configured to rotateabout an axis.
 17. The transcapacitive input device of claim 16, furthercomprising at least one sensor coupled to the substrate, the at leastone sensor configured to provide an indication of a pressure applied tothe substrate.
 18. The transcapacitive input device of claim 16, whereinthe at least one sensor is a tact switch.
 19. The transcapacitive inputdevice of claim 16, wherein the at least one sensor is a force sensor.20. The transcapacitive input device of claim 12, wherein the firstsubstrate is opaque.